Inorganic gas barrier film successfully developed

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Inorganic gas barrier film successfully developed in Japan

the film Chemistry Research Laboratory of the Institute of industrial technology, an independent administrative entity in Japan, has successfully developed a soft, 1000 ℃ high-temperature inorganic gas barrier film. By accurately laminating clay crystals with a thickness of about 1nm, the heat resistance and gas barrier properties of organic polymer materials are better than those of current organic polymer materials. It can be applied to the tensile testing machine of gas sealing materials used at high temperature to test the tear strength and the diaphragm of solid electrolyte fuel cell

previously, the heat-resistant gas barrier film was mainly made of engineering plastics by mixing, surface processing or multi-layer lamination with other materials according to specific needs. Previously, the common temperature of heat-resistant gas barrier films was generally limited to about 350 ℃

the gas barrier film with uniform thickness and no pores was successfully made by using a small amount of clay crystals added previously to improve the gas barrier of engineering plastics as the main material and optimizing clay materials, additives and manufacturing processes. Soft translucent gas barrier films can be made by precise lamination of clay crystals with a thickness of about 1nm. These materials will benefit the Indian aviation manufacturing industry. Because the clay crystal is very thin, it has softness and does not absorb light. By forming it precisely, it can be made into a translucent shape that can suppress light diffuse reflection. The film thickness is about the same as that of copy paper (3 ~ 100 μ m) , the proportion of the fuselage can be increased to 77.4% to form a thicker film by overlapping and laminating the film. There is no limit to the size of the film that can be processed

in addition, if the clay crystal is covered on the metal surface by the same method, a protective film can be made. At room temperature, the permeability of this gas barrier film to inorganic gases such as helium, hydrogen, oxygen and nitrogen is below the test limit, which is far higher than the previous engineering plastic materials (nylon 6 has a permeability of 18 to oxygen), and is equivalent to the performance of aluminum platinum (the permeability of oxygen is industrial 4.0 practice and utilization 0). In addition, the performance will not decline at a high temperature of 1000 degrees above the melting point of aluminum and platinum of 660 ℃

using the heat resistance of the gas barrier film, it can be used as packaging material outside automobile engines, pipe sealing material of chemical equipment, fuel sealing material outside rocket and jet aircraft engines, solid electrolyte fuel cell diaphragm, etc

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